Complex stress-engineered frangible structures

ABSTRACT

A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

RELATED APPLICATIONS

This application is a continuation of U.S. Ser. No. 16/025,573, filedJul. 2, 2018, which is a continuation of U.S. Ser. No. 15/092,313, filedApr. 6, 2016, now U.S. Pat. No. 10,012,250, which are incorporatedherein by reference in their entireties.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT

This invention is based upon work supported by DARPA under Contract No.HR001-16-C-0087 [New] Only-dust. Therefore, the Government has certainrights to this invention.

FIELD OF THE INVENTION

This invention relates to frangible structures, and in particular tofrangible structures formed using stress-engineered frangible materials.

BACKGROUND OF THE INVENTION

Frangible materials are materials, such as glass, that tend to break upinto fragments when subjected to a deforming force or impact, ascompared with non-frangible materials that elastically deform and retaincohesion when subjected to comparable deforming forces. The phrase“glass material” refers to any of various amorphous frangible materialsformed from a melt by cooling to rigidity without crystallization. Themost commonly known glass materials are usually transparent ortranslucent material consisting typically of a mixture of silicates, butthe phrase “glass material” is not limited to silicate-based glassunless otherwise specified.

Frangible structures (i.e., structures formed using one or morefrangible materials) are utilized in a wide range of practicalapplications ranging from small and simple to large and complex. Mostfrangible structures are designed to undergo structural failure (breakaway) when struck by an externally applied impact force. For example,light poles or airport lighting structures are designed to break awaywhen hit by a vehicle or plane in order to lessen damage to thevehicle/plane and minimize injury to the passengers. Some frangiblestructures are designed to undergo structural failure in response to anexternally generated command signal. For example, transient electronicdevices are frangible structures that include one or more electronicdevices (e.g., integrated circuit (IC) chip and/or printed electronicdevices) mounted on a stress-engineered glass substrate along with atrigger mechanism. The glass material forming the glass substrate isstress-engineered (e.g., intentionally fabricated using thermallytempered, ion-exchange treated, or lamination techniques) to storepotential energy in the form of residual internal stress gradients suchthat, when the stress-engineered glass substrate is subjected to arelatively small initial fracture force generated by the triggermechanism, the stored potential energy is released in the form of apropagating fracture force that is quickly transferred throughout theglass substrate.

Currently, there are no known methodologies for producing complexfrangible structures that undergo on-command structural failure inresponse to a single initiating force (i.e., where the single initiatingforce has a trigger area much smaller than the overall structural area,preferably smaller than 1 μm²). That is, there is no practical way togenerate a large complex structure, such as an airplane wing section,from a single (integrally-molded or machined) piece of frangiblematerial. Conversely, when multiple discrete stress-engineered glassstructures are adhered together to form the complex shape, propagatingfracture forces are unable to transfer from one frangible glassstructure to an adjacent frangible glass structure, thereby requiringmultiple triggering forces (i.e. one trigger mechanism for eachfrangible glass structure) to achieve complete structural failure of theentire complex frangible structure.

What is needed is a methodology for generating complex stress-engineeredfrangible structures that reliably undergoes on-command structuralfailure in response to a single triggering force with a triggering areamuch smaller than the structural area.

SUMMARY OF THE INVENTION

The present invention is directed to methods for forming novelinter-structure bonds that function to both structurally connectadjacent discrete glass members, and also to reliably transferpropagating fracture forces between the connected discrete glassmembers, thereby facilitating the production of complexstress-engineered frangible structures that both exhibit high structuralstrength during normal operation, and also undergo complete structuralfailure in response to a single (initial) fracture force duringemergency or other operating conditions. Because the method usesseparately formed (discrete) glass members that can have any size andshape (e.g., curved shapes, rods, sheets, tubs, or spheres), the methodfacilitates the production of a wide range of complex stress-engineeredfrangible structures (i.e., by way of forming the glass members ascomponent structural elements of the assembled complex structure). Tofacilitate both high structural strength during normal operation andon-command controlled structural failure, each discrete glass memberincludes a portion that is strengthened by way of stress-engineering toboth exhibit enhanced structural strength, and to store potential energyin an amount that transmits propagating fracture forces throughout theglass member in response to a sufficiently large initial fracture forcesuch that the glass member undergoes structural failure (i.e., fractureand/or fragmentation into two or more separate pieces). In alternativeembodiments, the strengthened glass portion of each glass member isgenerated either during formation of the glass member or by treating analready-formed (untreated) glass member using a stress-engineeringtechnique such as thermal tempering, laminating, or ion-exchangetreatment. To facilitate both rigid structural connection betweenadjacent discrete glass members, and also reliable transfer ofpropagating fracture forces between the connected discrete glassmembers, each novel inter-structure bond includes a bonding memberdirectly attached to one or more weaker member regions of one or more ofthe two connected glass members (e.g., with the bonding member connectedeither between a strengthened glass portion of one glass member and theweaker member region of the other glass member, or between weakenedglass portions disposed on both glass members). Because theweaker/weakened glass material of the one or more weaker member regionsis more susceptible to fracture (i.e., fractures in response to a lowerincident fracture energy), and because the one or more weaker memberregions extend into the downstream glass member, the novelinter-structure bonds generated in accordance with the present inventionfacilitates the reliable transfer of propagating fracture forces from anupstream (first) glass member to an adjacent downstream (second) glassmember by way of generating a transfer fracture force, in response topropagating fracture forces in the upstream glass member, that extendinto the weaker member region formed in the downstream glass member,thereby generating sufficient fracture energy to produce propagatingfracture forces in the downstream glass member. With this basicarrangement, the present invention facilitates reliably generatingpropagating fracture forces that are sequentially transferred fromconnected glass member to connected glass member until a desired amountof structural failure is generated in the contiguous complex stressengineered frangible structure. By way of controlling the initialfracture force (e.g., using an optional RF signal controlled triggermechanism), the present invention thus provides a new class offunctional complex frangible structures that disintegrate, lose mass, orotherwise undergo structural failure on command, whether for the safetyto an impacting object (e.g., in the case of light poles or airportstructures), or to control functionality (e.g., to optimize the trim ofa wing or propeller used on an aircraft).

According to an embodiment of the invention, a complex stress-engineeredfrangible structure capable of on-command structural failure is at leastpartially produced by assembling “core” structural elements includingtwo (first and second) discrete glass members that are directlyconnected by way of an intervening inter-structure bond, and an optionaltrigger mechanism directly connected to the first glass member. Asmentioned above, the glass members are separately formed (integral)glass pieces substantially made up of strengthened (stress-engineered)glass portions. The intervening inter-structure bond includes a bondingmember sandwiched between opposing surface regions of the first andsecond glass members, and the optional trigger mechanism is operablyattached to an associated surface region of the first glass member. Thetrigger mechanism is configured to generate, in response to a triggersignal, an initial fracture force in a localized region (point) in thefirst glass member, thereby producing an initial (first) propagatingfracture force in the first glass member that propagates (travels) byway of the strengthened glass material portion to all sections of thefirst glass member, eventually reaching the surface region of the firstglass member to which intervening bonding member is attached. When theinitial propagating fracture force is transmitted to the bonding member,the one or more weaker member regions and the bonding member combine togenerate a transfer fracture force that passes from the strengthenedglass portion of the first (upstream) glass member to the strengthenedglass portion of the second (downstream) glass member, where thetransfer fracture force has sufficient strength to initiate secondarypropagating fracture forces in the second glass member. By extendingthis methodology to generate complex stress-engineered frangiblestructures having a large number of additional discrete glass membersconnected directly or indirectly (i.e., through one or more interveningglass members) by way of associated inter-structure bonds to the firstglass member, the single initial fracture force generated by the triggermechanism is reliably utilized to fragment every glass member formingthe contiguous complex frangible structure. Accordingly, the presentinvention facilitates the production of a wide range of complexstress-engineered frangible structure configurations that undergoon-command structural failure by way of incorporating the “core”elements mentioned above (i.e., the first and second glass members, atleast one inter-structure bond, and the trigger mechanism).

According to an exemplary practical approach, complex stress-engineeredfrangible structures are produced by way of generating a weaker memberregion in at least one of the upstream and downstream glass members, andthen connecting each upstream and downstream glass member pair such thata bonding member (e.g., ceramic adhesive, low temperature glass frit,anodic bonding structures, or chemical bonds) is sandwiched between theupstream and downstream glass members, and such that the bonding memberpresses against and covers the weaker member region(s). In alternativeembodiments, the weaker member region is implemented by weakened glassportions (i.e., localized glass portions that are protected fromion-exchange or other stress-engineering treatment), by weakened surfacefeatures (i.e., sections of the glass surface that are etched, laserablated or otherwise weakened by way of removing glass material from thesecond glass member through a designated surface region), or by beingdisposed on a thinner (and thus weaker) section of stress-engineeredglass material. The upstream and downstream glass members are thenconnecting by way of the inter-structure bonds mentioned above such thateach bonding member is connected between an associated surface region ofan upstream glass member and associated weaker member region of acorresponding downstream glass member (i.e., such that the surfaceregion contacted by the bonding members entirely surrounds/covers theweaker member region). In the specific embodiment involving weakenedglass portions, the second glass member is provided by way of procuringor fabricating an untreated (i.e., non-stress-engineered) glass member,masking a designated surface region of the untreated glass member,ion-exchange treating all exposed surfaces the untreated glass member toconvert the second glass member into a stress-engineered glass memberincluding the weakened glass portion disposed under the mask, and thenremoving the mask. In the specific embodiment involving weakened surfacefeatures, the second glass member is subjected to stress-engineering,and then features are etched or otherwise formed in the strengthenedglass material to form the weakened surface feature. In alternativeexemplary embodiments, the weakened surface feature are defined as asingle (e.g., square) cavity, an array of cavities formed in awaffle-type pattern, or parallel slots. In each case, the removeduntreated material generates a localized weakened region in thedownstream glass member that greatly facilitates transfer of propagatingfracture forces from the upstream glass member to the downstream glassmember.

According to another practical approach, complex stress-engineeredfrangible structures are produced by way of procuring, fabricating orotherwise providing glass members in an untreated (i.e.,non-stress-engineered) state, connecting the glass members using hightemperature glass bonding techniques (e.g., high-temperature glass-fritor glass welding) such that a bonding member is connected betweenopposing surface regions of the glass members, and then subjectingexposed portions of the untreated glass members to an ion-exchangetreatment to form stress-engineered glass members connected by aninter-structure bond. In this case, the inter-structure bond includesthe bonding member and two weakened glass portions (member regions) thatare respectively formed on opposite sides of the bonding member byportions of the two glass members that are shielded during ion-exchangetreatment. To avoid structural problems caused by high-temperaturebonding, the discrete untreated glass members are respectively formedfrom glass materials having the same or similar CTE values. In oneembodiment, channels are formed in exposed surface portions of theuntreated glass members prior to ion-exchange treatment.

According to another embodiment of the present invention, a method isprovided for producing a complex frangible structure in whichpropagating fracture forces are transferrable in only one direction(i.e., only from upstream glass members to downstream glass members, andnot in the reverse direction). This feature is useful, for example, whenone part of a structure needs to be intact but still structurally bondedto the overall complex structure. Any accidental breakage of the otherparts will not affect the structure that needs to stay intact until thevery end. This method will ensure a particular user sequence offracturing will occur in a multi-triggerable system. The method involvesproducing all glass members in the manner described above such that theglass members are sized and shaped to collectively form a complexfrangible structure, with one glass member designated as a first(most-upstream) glass member, one or more glass members designated asthe last (most-downstream) glass member(s), and all other glass membersdesignated as intermediate glass members that are downstream to thefirst glass member and upstream to the last glass member(s). Bondingregions are designated between adjacent associated upstream/downstreampairs of the glass members such that a fracture path is defined from thefirst glass member to the last glass member(s) by way of any interveningintermediate glass members and inter-structure bonds. To facilitateone-way crack propagation, the weaker member regions (i.e., weakenedsurface features and/or weakened glass portions) are formed only on thedownstream side of each bonding region (i.e., only on the downstreamglass member of each associated upstream/downstream glass member pair).The glass members are then interconnected by way of forminginter-structure bonds in the manner described above such that eachbonding member is disposed between a strengthened glass portion of theupstream glass member and the weaker member region of the downstreamglass member. A trigger mechanism is also connected to the first glassmember, either before, during or after the bonding process. Theresulting complex frangible structure thus exhibits one-way propagatingfracture forces that are initiating in the first glass member by thetrigger mechanism, and are sequentially transferred in only onedirection (i.e., only from upstream to downstream glass members of eachconnected upstream/downstream pair) until the facture forces reach thelast glass member(s).

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the presentinvention will become better understood with regard to the followingdescription, appended claims, and accompanying drawings, where:

FIG. 1 is a top side perspective view showing a complexstress-engineered frangible structure according to a simplifiedembodiment of the present invention;

FIG. 2 is a flow diagram showing a generalized method for producing thecomplex stress-engineered frangible structure of FIG. 1;

FIG. 3 is a flow diagram depicting an After Ion-Exchange Treatmentapproach for producing complex stress-engineered frangible structuresaccording to a first practical embodiment;

FIGS. 4(A), 4(B1), 4(B2), 4(C1), 4(C2), 4(D1), 4(D2), 4(E), 4(F), 4(G),4(H) and 4(I) are simplified cross-sectional side views depicting theAfter Ion-Exchange Treatment approach of FIG. 3;

FIGS. 5(A), 5(B), 5(C) and 5(d) are partial perspective views showingweaker member regions generated during the After Ion-Exchange Treatmentapproach of FIG. 3 according to alternative exemplary specificembodiments;

FIG. 6 is a flow diagram showing a Before Ion-Exchange Treatmentapproach for producing complex stress-engineered frangible structuresaccording to a second practical embodiment;

FIGS. 7(A), 7(B), 7(C), 7(D), 7(E), 7(F), 7(G) and 7(H) are simplifiedcross-sectional side views depicting the Before Ion-Exchange Treatmentapproach of FIG. 6; and

FIG. 8 is a flow diagram showing a method for producing complexstress-engineered frangible structures exhibiting one-way crackpropagation according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE DRAWINGS

The present invention relates to an improvement in frangible structures.The following description is presented to enable one of ordinary skillin the art to make and use the invention as provided in the context of aparticular application and its requirements. As used herein, directionalterms such as “upper”, “upward”, “lower”, “downward”, “under” and “over”are intended to provide relative positions for purposes of description,and are not intended to designate an absolute frame of reference. Theterms “coupled” and “connected”, which are utilized herein, are definedas follows. The term “connected” is used to describe a direct connectionbetween two structural elements, for example, by way of an adhesive orother bonding member. In contrast, the term “coupled” is used todescribe either a direct connection or an indirect connection betweentwo structural elements. For example, two coupled elements may bedirectly connected by way of a bond, or indirectly connected by way ofan intervening structural element. The term “integral” is used to referto a structural element (such as a glass member or piece) that isentirely separately produced by way of molding or machining a singlematerial piece. Various modifications to the preferred embodiment willbe apparent to those with skill in the art, and the general principlesdefined herein may be applied to other embodiments. Therefore, thepresent invention is not intended to be limited to the particularembodiments shown and described, but is to be accorded the widest scopeconsistent with the principles and novel features herein disclosed.

FIG. 1 includes simplified perspective views showing a complexstress-engineered frangible structure 100 in a contiguous state (i.e.,frangible structure 100(t 0) shown in the middle portion of FIG. 1) andan exemplary fractured state (i.e., frangible structure 100(t 2) shownin the lower portion of FIG. 1). In the contiguous state (e.g.,immediately after production, during normal operation, and duringportions of a transient event occurring prior to fracture), frangiblestructure 100(t 0) generally includes two discrete glass members 110-1and 110-2, an inter-structure bond 120 and an optional trigger mechanism130.

As utilized herein, the phrase “discrete glass member” refers to aseparate (integral) glass pieces formed using known techniques (i.e.,heating the glass material to a molten state, forming the molten glassinto a desired final shape, and then cooling the molten glass to roomtemperature). An advantage to forming complex stress-engineeredfrangible structure 100 using discrete glass members 110-1 and 110-2 isthat combining and bonding discrete glass members facilitates theproduction of complex structural shapes far more efficiently and withless expense than forming the same complex structural shape from asingle integral glass piece.

In order to produce frangible structure 100 such that it both providessufficient structural strength during normal operation and alsoundergoes on-command fragmentation (structural failure), it is necessaryto fabricate or procure stress-engineered glass members having thecharacteristics set forth below. Referring to the middle of FIG. 1,glass members 110-1 and 110-2 are depicted as wafer-like structureshaving opposing upper and lower surfaces 112-1 and 112-2 and 113-1 and113-2, respectively, but in practice glass members 110-1 and 110-2 canhave any practical shape (e.g., curved shapes, rods, sheets, tubs, orspheres). Glass members 110-1 and 110-2 are separately formed (integral)glass pieces mostly comprising strengthened glass portions 111-11S and111-21S, respectively, where strengthened glass portions 111-11S and111-21S comprise glass material that has been fabricated or treatedusing a known stress-engineering technique such as thermal tempering,laminating, or ion-exchange treatment such that strengthened glassportions 111-11S and 111-21S both exhibits substantially higherstructural strength than non-stress-engineered glass material of thesame type, and stores potential energy in a sufficient amount togenerate the propagating fracture forces described below. In a presentlypreferred embodiment, strengthened glass portions 111-11S and 111-21S ofglass members 110-1 and 110-2 comprise ion-exchange treated glassmaterial formed using known techniques. In another exemplary embodiment,as indicated in the upper left bubble of FIG. 1, glass members 110-1 and110-2 comprise two interspersed thermally tempered glass materials(e.g., with multiple thermally tempered glass material portions 111-S21,111-S22 and 111-S23 disposed in a different (first) thermally temperedglass material 111-S1. When implemented using ion-exchange treatment orany of the other specific stress-engineering processes mentioned above,glass members 110-1 and 110-2 are configured to contain enough storedpotential energy to generate self-propagating secondary fracture forcesin response to an initial fracture force such that, as depicted byshattered structure 100(t 2) at the bottom of FIG. 1), glass members110-1 and 110-2 partially or completely break apart into smallerfragments using a mechanism similar to that captured in a PrinceRupert's Drop. In addition, in one embodiment, the released potentialenergy also fractures portions of optional trigger mechanism 130 and anyother structures that might be disposed on glass members 110-1 and110-2.

As indicated in FIG. 1, inter-structure bond 120 functions to fixedlyconnect (bond) lower (first) glass member 110-1 to upper (second) glassmember 110-2 by way of a bonding member 125 (sandwiched) between anupward-facing surface region 113-11 of first glass member 110-1 and anopposing downward-facing surface region 112-21 of second glass member110-2. In alternative exemplary embodiments, bonding member 125 isimplemented using a ceramic adhesive, a glass-frit structure, an anodicbonding structure, or a chemical bond.

In one embodiment, trigger mechanism 130 is attached to a second surfaceregion 113-12 of first glass member 110-1, and is configured to generatean initial fracture force F₀ in glass member 110-1 having sufficientfracture energy to initiate first propagating fracture force F_(P1) instrengthened portion 111-11S of first glass member 110-1. In a specificembodiment, trigger mechanism is controlled by way of an electronictrigger signal TS generated by a sensor 160, which in turn generatestrigger signal TS in response to a wireless transmitted wave signal(e.g., a light wave signal, a radio frequency, or an acoustic/soundsignal, not shown), whereby frangible structure 100 can be remotelyactuated to undergo on-command structural failure. In one embodiment,trigger mechanism 130 generates initial fracture force F₀ using aself-limiting resistive element and a switch element that are connectedin series between a battery (or other DC power source) and ground in themanner described in co-owned and co-pending U.S. Publication No.20180033577 which is incorporated herein by reference in its entirety.

According to an aspect of the present invention, bonding member 125 ofinter-structure bond 120 is directly attached to at least one weakermember region of at least one of glass members 110-1 and 110-2.Referring to the lower right bubble in FIG. 1, a glass portion 111-12Mof glass member 110-1 is depicted by the dashed-line box disposeddirectly below bonding member 125, and glass portion 111-22M of glassmember 110-2 is depicted by the dashed-line box disposed directly abovebonding member 125. Note that glass portion 111-12M is contiguous withupper surface region 113-11 of first glass member 110-1, and that glassportion 111-22M is contiguous with lower surface region 112-21 of firstglass member 110-1. According to this aspect, at least one of the twoglass portions 111-12M and 111-22M comprises a weaker member region(i.e., glass material that is, e.g., either subjected to mechanicalalteration or shielded from stress-engineering such that the glassmaterial is structurally weaker than the stress-engineered glassmaterial forming strengthened portions 111-11S and 111-21S). Forexample, in one exemplary alternative embodiment, all three ofstrengthened portions 111-11S and 111-21S and glass portions 111-12Mcomprise ion-exchange treated glass material (i.e., stress-engineered,relatively thick glass material), and glass portion 111-22M comprisesthe weaker member region (e.g., glass material that is partially orfully shielded from ion-exchange treatment, glass material that has beenmechanically weakened, e.g., by way of etching, or relatively thinstress-engineered glass material). Alternatively, all three ofstrengthened portions 111-11S and 111-21S and glass portion 111-22Mcomprise strengthened (e.g., ion-exchange treated) glass material, andglass portion 111-12M comprises the weaker member region. In a thirdexample, strengthened portions 111-11S and 111-21S comprisestress-engineered glass material, and both glass portions 111-12M and111-22M comprise weaker member regions. Detailed examples used to formweaker member regions are provided below.

According to another aspect of the present invention, bonding member 125and the weaker member region(s) (i.e., either or both of glass portions111-12M and 11122M) are configured (i.e., operably formed andpositioned) to transfer propagating fracture forces F_(P1) from firstglass member 110-1 to second glass member 110-2 by way of a transferfracture force F_(F1) such that secondary propagating fracture forcesF_(P2) are generated in strengthened glass portion 111-21S of secondglass member 110-2. That is, as depicted in the lower right bubble inFIG. 1, the weaker member region(s) and bonding member 125 producetransfer fracture force F_(F1), which is applied in localized region111-21SL of strengthened portion 111-21S of glass member 110-2, therebygenerating secondary propagating fracture forces F_(P2) in strengthenedportion 111-21S of glass member 110-2. Although not illustrated in FIG.1, secondary propagating fracture forces F_(P2) travel throughout secondglass member 110-2 such that glass member 110-2 is fragmented. In thisway, initial fracture force F_(F0) generated in first glass member 110-1by trigger mechanism 130 results in structural failure of second glassmember 110-2 by way of secondary propagating fracture forces F_(P2). Theinventors found that forming inter-structure bond 120 with one or moreweaker member regions adjacent to bonding member 125 greatly facilitatesthe transfer of propagating fracture forces between two discrete glassmembers because the weakened glass material of the weaker memberregion(s) more reliably fractures in response to relatively weaktransferred fracture forces. Moreover, by limiting the weaker/weakenedglass material to the region immediately adjacent the bonding member125, the present invention facilitates the transfer of fracture forcesbetween adjacent members without significantly weakening contiguouscomplex stress-engineered frangible structure 100.

FIG. 2 is a flow diagram showing a generalized method for producingcomplex stress-engineered frangible structures. For brevity, thegeneralized method is described with reference to the production of thesimplified, two-member frangible structure shown in FIG. 1, althoughthose skilled in the art will understand that the described methodologyis extendable to form complex stress-engineered frangible structureshaving any desired shape, size and number of glass elements. The blocknumbers mentioned below refer to the blocks shown in FIG. 2, and elementnumbers mentioned below refer to corresponding structures shown in FIG.1.

Referring to the top of FIG. 2, block 205 involves providing (i.e.,fabricating or procuring) discrete glass members having requiredassociated sizes and shapes such that, when operably assembled andinterconnected, the provided glass members implement componentstructural elements that collectively form the complex structural shapeof a desired complex stress-engineered frangible structure. Using thesimplified embodiment of FIG. 1, providing the glass members involvesseparately fabricating glass members 110-1 and 110-2 using either normalglass forming techniques or stress-engineering glass fabricationtechniques. According to an embodiment of the present invention,providing the discrete glass members includes producing the glassmembers using normal glass forming techniques (i.e., such that all ofthe the glass material of each glass member is in an untreated state,i.e., not yet stress-engineered).

Block 210 of FIG. 2 involves processing and assembling (interconnecting)the component glass members using the novel inter-structure bondsdescribed herein to form the desired complex frangible structure. Usingfrangible structure 100 of FIG. 1 as a simplified example, glass members110-1 and 110-2 are processed and directly connected usinginter-structure bond 120 to glass member 110-2 such that bonding member125 contacts at least one weaker member region as described above. Notethat, once operably processed and connected, glass members 110-1 and110-2 and inter-structure bond 120 are configured to transfer firstpropagating fracture forces F_(P1) from strengthened portion 111-11S ofglass member 110-1 to strengthened portion 111-21S of glass member 110-2such that secondary propagating fracture forces F_(P2) are generated inglass member 110-2 in response to transfer fracture force F_(F1).

Referring to the lower portion of FIG. 2, block 220 includes an optionalprocess involving mounting a trigger mechanism onto one of the glassmembers using known techniques. Using the simplified example of FIG. 1,this process involves mounting trigger mechanism 130 onto upper surfaceregion 113-12 of first glass member 110-1 using a suitable adhesive orother mechanism such that initial fracture force F_(F1) is operablytransferred into glass member 110-1. In alternative embodiments, triggermechanism 130 is mounted onto glass member 110-1 either before or afterglass member 110-1 is connected to glass member 110-2 by way ofinter-structure bond 120 (i.e., unless otherwise specified, block 220may be performed before or during block 210).

According to alternative specific embodiments, the generalizedproduction method of FIG. 2 is presented below in additional detail withreference to two alternative approaches. An “After Ion-Exchange Bonding”approach is described below with reference to FIGS. 3, 4(A) to 4(I), and5(A) to 5(D), and generally involves bonding discrete glass membersafter the glass members have been subjected to ion-exchange-typestress-engineering treatment treated to patterned stress-engineeringtreatment. A “Before Ion-Exchange Bonding” approach is then describedwith reference to FIGS. 6 and 7(A) to 7(G), and generally involvesbonding discrete glass members before subjecting the glass members toion-exchange-type stress-engineering treatment. These two exemplarymethods represent currently preferred practical methodologies forimplementing the generalized production method of FIG. 2, but are notintended to be limiting unless otherwise specified in the claims.

Referring to FIG. 3, the procuring/fabricating and assembly (blocks 205and 210, FIG. 2) portion of the generalized production method accordingto the After Ion-Exchange Bonding approach generally includes forming aweaker member region in each downstream (second) glass member 110A-2,and then connecting upstream (first) glass member 110A-1 to downstreamglass member such that a bonding member is sandwiched between theupstream and downstream glass members and presses against and covers theweaker member region(s). The After Ion-Exchange Bonding approach isdescribed with reference to two alternative exemplary practicalembodiments: a first practical embodiment including blocks 205A, 312,313, 314A and 315 involving the generation of a weaker member region inthe form of a weakened glass region, and a second practical embodimentincluding blocks 205A, 312, 313, 314A and 315 involving the generationof a weaker member region in the form of a weakened surface feature.Because the overall process flow of these alternative practicalembodiments is substantially the same, the weakened glass regionembodiment process (i.e., blocks 205A, 312, 313, 314A and 315 of FIG. 3)will be described with reference to FIGS. 4(A), 4(B1), 4(C1), 4(D1) and4(E), and the weakened surface feature embodiment process (i.e., blocks205A, 313, 314B and 315 of FIG. 3) will be described with reference toFIGS. 4(A), 4(B2), 4(C2), 4(D2) and 4(E). Note that FIGS. 4(A) to 4(F)which depict upstream and downstream glass members and associatedfeatures in simplified side view.

Referring to block 205A (FIG. 3) and to FIG. 4(A), the “AfterIon-Exchange Bonding” production method approach begins with procuringor fabricating (providing) untreated (i.e., non-stress-engineered) glassmembers 110A-1A and 110A-2A (i.e., such that glass member 110A-1Aentirely comprises “weakened” (untreated) glass material 111A-1, andglass member 110A-2A entirely comprises “weakened” glass material111A-2). According to an aspect of the present embodiment, untreatedglass members 110A-1A and 110A-2A can have varying thicknesses (e.g.,thickness T_(110A-1A) of glass member 110A-1A can be different fromthickness T_(110A-2A) of glass member 110A-2A) because propagatingfracture forces (cracks) only occur at a surface of each member.

Block 312 and to FIG. 4(B1) are associated with the weakened glassportion embodiment, and involve forming a mask 410 (e.g., photoresist orother material) over a designated surface region 112A-21 of untreatedglass member 110A-2A (i.e., over a region of glass member 110A-2A thatis designated for weakening). As depicted in FIG. 4(B1), designatedsurface region 112A-21 to which mask 410 is applied is located under anuntreated (and thus “weakened”) glass portion 111A-21W of glass member110A-2A. The shape/pattern of mask 410 is determined by the weakenedsurface feature pattern to be formed in glass member 110A-2A. Note thatno processing of glass member 110A-1A occurs at this time. Note also, asshown in FIG. 4(B2), that no mask is formed in conjunction with theweakened surface feature embodiment at this time.

Referring to block 313 (FIG. 3) and to FIGS. 4(C1) and 4(C2), allexposed surfaces of both untreated glass members 110A-1A and 110A-2A arethen subjected to ion-exchange treatment, thereby converting theunprocessed glass members in to stress-engineered glass members 110A-1and 110A-2 (i.e., having features consistent with glass members 110-1and 110-2 of FIG. 1). Referring to FIG. 4(C1), according to the weakenedglass portion approach, note that the entire upper surface 113A-2 andexposed portions of lower surface 112A-2 are fully ion-exchange treated,but mask 410 limits or entirely prevents ion-exchange treatment fromentering weakened glass portion 111A-21A through masked surface region112A-21A, whereby glass member 110A-2 is processed to include a largestrengthened glass portion 111A-22S and a relative small weakened glassportion 111A-21A. In contrast, all regions of upper surface 113A-1 andlower surface 112A-1 of glass member 110A-1 are subjected toion-exchange treatment. Note also that generating weakened glass portion111A-21A only on glass member 110A-2 produces a one-way crackpropagation bond (i.e., cracks must propagate from glass member 110A-1to glass member 110A-2). In an alternative embodiment, both sides of thebonded area are masked and weakened. For example, as indicated in FIG.4(C1), a corresponding region 111A-11 of glass member 110A-1 can besubjected to masking and similarly weakened, which would result intwo-way crack propagation. Note also that the surface area of weakenedglass portion 111A-21A is always smaller than the bonded area. Referringto FIG. 4(C2), in the weakened surface feature embodiment, because bothuntreated glass members are entirely exposed, all surfaces 112A-1,113A-1, 112A-2 and 113A-2 are subjected to ion-exchange treatment,thereby producing stress-engineered glass members 110A-1 and 110A-2substantially entirely made up of strengthened glass material 111A-12Sand 111A-22S (i.e., designated bonding regions 111A-21S and 111A-11Sboth comprise strengthened glass).

Referring to block 314A (FIG. 3) and to FIG. 4(D1), the last step of theweakened glass portion approach involves removing mask 410 from glassmember 110A-2, thereby exposing designated bonding surface region112A-21A of glass member 111A-2. FIG. 5(A) depicts an exemplary portionof a glass member 110A-21 indicating an exemplary weakened glass region111A-21W disposed within designated surface region 112A-22, andindicates that the designated bonding surface region 112A-21 againstwhich the bonding member will be pressed entirely surrounds surfaceregion 112A-22. Referring again to FIG. 4(D1), note also that glassmember 111A-2 now includes relatively small weakened glass portion(member region) 111A-21W and relatively large strengthened glass portion111A-22S. Note also that the corresponding designated bonding region111A-11 of glass member 111A-1 is strengthened (i.e., stress-engineeredusing the same process as that used to form strengthened glass portion111A-21).

Referring to block 314B (FIG. 3) and to FIG. 4(D2), the next step of theweakened surface feature embodiment involves forming weakened surfacefeature 111A-21F in glass member 110A-2 by way of removing glassmaterial from strengthened portion 111A-21S through designated surfaceregion 112A-22. In one specific embodiment, this glass removal processis achieved by etching (i.e., applying a suitable chemical etchant 420using known techniques) designated surface region 112A-22 to define oneor more cavities in glass member 110A-2. FIGS. 5(B) to 5(D) depictsimplified exemplary weakened surface features 111A-21F1 to 111A-21F3.FIG. 5(B) depicts a single (e.g., square) cavity weakened surfacefeatures 111A-21F1 etched through surface region 112A-21 of lowersurface 112A-2 of a glass member 110A-22 entirely within designatedbonding surface region 112A-21. FIG. 5(C) depicts a second weakenedsurface feature 111A-21F2 including multiple adjacent cavities arrangedin a checkerboard or waffle-type pattern that are etched through surfaceregion 112A-21 of lower surface 112A-2 of glass member 110A-22 andentirely within designated bonding surface region 112A-21). FIG. 5(D)depicts a third (slot or line-type) weakened surface feature 111A-21F3etched through surface region 112A-21 lower surface 112A-2 of glassmember 110A-23 and entirely designated bonding surface region 112A-21).The size of weakened surface features 111A-21F1 to 111A-21F3 isdetermined by the glass materials and other conditions, and theinventors presently believe that features occupying surface regions assmall as 1 μm by 1 μm may be utilized.

Referring to block 315 (FIG. 3) and to FIG. 4(E), the first glass member11A-1 is then connected to second glass member 110A-2 using a bondingmember 125A and an associated low-temperature (i.e., less than 400° C.)bonding technique, thereby completing bond 120A including bonding member125A and weaker member region 111A-21M (i.e., one of weakened glassportion 111A-21W or weakened surface features 111A-21F, which aretransposed in FIG. 4(E) for illustrative purposes). In alternativespecific embodiments, connecting glass members 110A-1 and 110A-2includes utilizing one of a ceramic adhesive, a low temperatureglass-frit, an anodic bonding structure, and a chemical bond to formbonding member 125A. Note that width W22 of contact surface region112A-22 that is contacted by glass member 125A is larger than width W21of designated surface region 112A-21, which defines the width of weakermember region 111A-21M. That is, as indicated in additional detail inFIGS. 5(A) to 5(D), in each instance the area of contact surface region112A-22 entirely surrounds weakened glass portion 111A-21W and weakenedsurface features 111A-21F1 to 11A-21F3. Depending on bondingtemperature, glass members 110A-1 and 110A-2 may be formed using glassmaterials having different coefficient of thermal expansion (CTE) values(i.e., the lower the bonding process temperature, the greater thedifference in CTE between the two glass members).

Referring again to the bottom of FIG. 3 and to FIG. 4(F), subsequentproduction processing includes mounting (operably attaching) triggermechanism onto a corresponding surface region 113A-12 of upper surface113A-1 on glass member 110A-1, thereby completing the production ofcomplex stress-engineered frangible structure 100A according to the“After Ion-Exchange Bonding” approach. Note that frangible structure100A is characterized by weaker member region 111A-21M disposed onsecond glass member 110A-2, and that bonding member 125A is sandwichedbetween surface region 113A-21 of glass member 110A-1 and correspondingsurface region 112A-21 of glass member 110A-2, where the bonded surfaceregion 112A-21 entirely surrounds weaker member region 111A-21M, asdiscussed above with reference to FIGS. 5(A) to 5(D). In effect, bondingmember 125A is connected between weaker member region 111A-21M ofdownstream glass member 111A-2 and strengthened glass portion 111A-11Sof upstream glass member 111A-1. In this state, complexstress-engineered frangible structure 100A is ready to deploy.

FIGS. 4(G) to 4(I) depict a simplified structural failure of complexstress-engineered frangible structure 100A by way of a one-way crack(fracture) propagation pattern. Referring to FIG. 4(G), a time (t0)represents a moment that on-command structural failure of frangiblestructure 100A is desired, and is initiated by way of applying triggersignal TS to trigger mechanism 130A. As explained above, triggermechanism 130A is configured to generate an initial fracture forceF_(F0) in response to trigger signal TS, where initial fracture forceF_(F0) has sufficient energy to generate a first propagating fractureforce F_(P1) in strengthened portion 111A-12S of glass member 110A-1.Note that that, at time to, first propagating fracture force F_(P1) hasnot yet reached inter-structure bond 120A, so glass member 110A-2remains entirely intact and un-fractured. FIG. 4(H) shows frangiblestructure 100A at a subsequent time (t1) when propagating fracture forceF_(P1) has traveled throughout glass member 110A-1 and reachedinter-structure bond 120A. As described above, bonding member 125A andweaker member region 111A-21M (which includes, e.g., either weakenedglass portion 111A-21W shown in FIG. 4(D1) or weakened surface feature111A-21F shown in FIG. 4(D2)) are configured to transfer firstpropagating fracture forces F_(P1) by way of secondary fracture forceF_(F1) from glass member 110A-1 adjacent glass member 110A-2 such thatsecondary propagating fracture forces F_(P2) are generated instrengthened glass portion 111A-21S of glass member 110A-2. FIG. 4(I)shows frangible structure 100A at a subsequent time (t2) when secondarypropagating fracture forces F_(P2) propagate through glass member110B-2, whereby a single initial fracture force F_(F0) generated inglass member 110A-1 by trigger mechanism 130A results in structuralfailure of second glass member 110A-2.

The “Before Ion-Exchange Bonding” production method approach andsubsequent on-command structural failure will now be described withreference to FIG. 6 and to FIGS. 7(A) to 7(H).

Referring to block 205B (FIG. 6) and to FIG. 7(A), the “BeforeIon-Exchange Bonding” production method approach begins with procuringor fabricating (providing) untreated (i.e., non-stress-engineered) glassmembers 110B-1A and 110B-2A (i.e., glass members 110B-1A and 110B-2Aentirely comprise “weakened” (untreated) glass material 111B-1 and111B-2, respectively). According to an aspect of the “BeforeIon-Exchange Bonding” approach, untreated glass members 110B-1A and110B-2A preferably have similar thicknesses (i.e., thickness T_(110B-1A)of glass member 110B-1A is substantially equal to thickness T_(110B-2A)of glass member 110B-2A) in order to avoid CTE related issues associatedwith high-temperature bonding and subsequent processing. However, thecomponent member thicknesses may be varied is some instances to vary thefracturing and strength properties of the contiguous frangiblestructure.

Referring to block 612 and to FIG. 7(B), an inter-structure bond 120B isformed by connecting a designated surface bonding region 113B-11 onupper surface 113B-1 of glass member 110B-1A to an opposing designatedsurface region 112B-21 on lower surface 112B-2 of glass member 110B-2Aby way of an intervening glass bonding member 125B (e.g., ahigh-temperature glass-frit structure, or a glass welding structure). Inthis case, inter-structure bond 120B includes glass bonding member 125B,a first weakened glass portion 111B-11W disposed in untreated glassmember 110B-1A adjacent to designated surface region 113B-11, and asecond weakened glass portion 111B-21W disposed in untreated glassmember 110B-2A adjacent to designated surface region 112B-21. Theseregions are designated by dashed lines in FIG. 7(B) to indicate thatthese regions remain contiguous with the remaining untreated glassmaterial forming untreated glass members 111B-1A and 111B-2A. Note thatweakened glass portions 111B-11W and 111B-21W become the weaker memberregions of the to-be-completed inter-structure bond.

Referring to blocks 613 and 614 and to FIGS. 7(C) and 7(D), exposedportions of untreated glass members 110B-1A and 110B-2A are then exposedto an ion-exchange treatment such that untreated glass members 110B-1Aand 110B-2A are converted into stress-engineered glass members 110B-1and 110B-2, respectively, that are connected by inter-structure bond120B. Referring to block 613 and to FIG. 7(C), in one embodimentchannels are formed in exposed surface portions of untreated glassmembers 110B-1A and 110B-2A using a suitable channel forming process710. Note that the channels are formed so as not to allow ion-exchangetreatment of weakened glass portions 111B-11W and 111B-21W. Referring toblock 614 and FIG. 7(D), glass members 110B-1 and 110B-2 are thenexposed to ion-exchange treatment, where the channels mentioned abovefacilitate treatment of all desired surfaces in the chemical bath, andprovide paths for the chemical to be drained and rinsed from glassmembers 110B-1 and 110B-2 after being pulled out of the bath.

Referring again to the bottom of FIG. 6 and to FIG. 7(E), subsequentproduction processing includes mounting (operably attaching) triggermechanism 130B onto a corresponding surface region on upper surface113B-1 of glass member 110B-1, thereby completing the production ofcomplex stress-engineered frangible structure 100B according to the“Before Ion-Exchange Bonding” approach. Note that frangible structure100B is characterized in that inter-structure bond 120B includesweakened glass portions (member regions) 111B-11W and 111B-21W disposedglass members 110B-1 and 110B-2, respectively, and bonding member 125Bsandwiched between opposing surface regions 113B-11 and 112B-21 of glassmembers 110B-1 and 110B-2, respectively. At this point complexstress-engineered frangible structure 100B is ready to deploy.

FIGS. 7(F) to 7(H) depict a simulated on-command structural failure ofcomplex stress-engineered frangible structure 100B according to anexemplary embodiment. Referring to FIG. 7(F), at time t(0) theon-command structural failure of frangible structure 100B is initiatedby way of actuating trigger mechanism 130B to generate an initialfracture force F_(F0), which in turn generates first propagatingfracture force F_(P1) in glass member 110B-1. FIG. 7(G) shows frangiblestructure 100B at a subsequent time (t1) when propagating fracture forceF_(P1) has traveled throughout glass member 110B-1 and reachedinter-structure bond 120B. As described above, bonding member 125B andweakened glass portions (member regions) 111B-11W and 111B-21W areconfigured to transfer first propagating fracture forces F_(P1) by wayof secondary fracture force F_(F1) from glass member 110B-1 adjacentglass member 110B-2 such that secondary propagating fracture forcesF_(P2) are generated in strengthened glass portion 111B-22S of glassmember 110A-2. FIG. 7(H) shows frangible structure 100B at a subsequenttime (t2) when secondary propagating fracture forces F_(P2) propagatethrough glass member 110B-2, whereby structural failure of frangiblestructure 100B is achieved.

FIG. 8 is a flow diagram showing a method for producing complexstress-engineered frangible structures in which propagating fractureforces are transferrable in only one direction. The method utilizesprocesses similar to those described above with reference to FIGS. 4(A)to 4(I), and therefore the method will be described with reference tothose figures.

Referring to block 811 in FIG. 8 and to FIG. 4(A), the method begins byproducing glass members (e.g., glass members 110A-1 and 110A-2) in themanner described above such that the glass members are sized and shapedto collectively form a desired complex frangible structure 100A. In thecase of multiple glass members, one glass member (e.g., glass member110A-1) is designated as a first (most-upstream) glass member, one ormore glass members (e.g., glass member 110A-2) is designated as the last(most-downstream) glass member(s) 110A-2, and all other glass members(not shown in FIG. 4(A)) are designated as intermediate glass membersthat are downstream to the first glass member (and any other precedingglass members in the crack propagation path) and upstream to the lastglass member(s) (and any other subsequent glass members in the crackpropagation path). Bonding regions (e.g., referring to FIG. 4(B1),surface regions 113A-11 and 112A-21 of glass members 110A-1 and 110A-2,respectively) are designated between adjacent associatedupstream/downstream pairs of the glass members such that a fracture pathis defined from the first glass member to the last glass member(s) byway of any intervening intermediate glass members and inter-structurebonds (e.g., in the simplified case of two glass members, from glassmember 110A-1 to glass member 110A-2 by way of inter-structure bond120A). To facilitate one-way crack propagation, weaker member regions(e.g., either weakened surface region 111A-21W shown in FIG. 4(D1) orweakened surface feature 111A-21F shown in FIG. 4(D2)) are formed onlyon the downstream side of each bonding region (i.e., only on downstreamglass member 110A-2 of the associated upstream/downstream glass memberpair comprising glass members 110A-1 and 110A-2).

Referring to block 812 (FIG. 8) and to FIGS. 4(E) and 4(F), the glassmembers are then interconnected by way of forming inter-structure bondsin the manner described above such that each bonding member (e.g.,bonding member 125A in FIGS. 4(E) and 4(F)) is disposed between astrengthened glass portion of the upstream glass member (e.g., portion111A-11S of glass member 110A-1, shown in FIG. 4(E)) and weaker memberregion 111A-21M of downstream glass member 110A-2.

Referring to block 812 (FIG. 8) and to FIG. 4(F), a trigger mechanism(e.g., mechanism 130A) is also connected to the first glass member(i.e., glass member 110A-1), which is depicted as occurring after thebonding process, but may alternatively occur either before or at anytime during the bonding process.

The resulting complex frangible structure, which in a simplified form isgenerally consistent structure 100A of FIG. 4(F), exhibits one-way crackpropagation in which propagating fracture forces can only be transferredfrom upstream glass members to downstream glass members, and not in theopposite direction. For example, referring to FIGS. 4(G) to 4(I),propagating fracture forces F_(P1) initiated in first glass member110A-1 (upstream side0 by trigger mechanism 130A are transferred in adownstream direction from upstream glass member 110A-1 to downstreamglass member 110A-2 (downstream side) by way of inter-structure bond120A. In contrast, if a propagating fracture force is unintentionallyinitiated in downstream glass member 110A-2 (e.g., due to inadvertentimpact by a flying rock), the one-way crack propagation approach wouldprevent transfer of propagating fracture forces from glass member 110A-2to upstream glass member 110A-1.

Although the present invention has been described with respect tocertain specific embodiments, it will be clear to those skilled in theart that the inventive features of the present invention are applicableto other embodiments as well, all of which are intended to fall withinthe scope of the present invention. For example, although the exemplaryembodiments show complex stress-engineered frangible structurescomprisingonly two glass members, the various features and aspects ofthe invention set forth above can be used to produce complexstress-engineered frangible structures having any number ofinterconnected discrete glass members. Moreover, although the exemplaryembodiments depict only a single inter-structure bond connecting twodiscrete glass members, any number of inter-structure bonds may beutilized to connect two discrete glass members, although the use of asingle fracture transfer point is presently preferred. Further, otherbonding methods (e.g., adhesives) may be used in combination with thedisclosed inter-structure bonds to further strengthen the contiguouscomplex stress-engineered frangible structure.

The invention claimed is:
 1. A stress-engineered frangible structure,comprising: a plurality of interconnected discrete glass memberscomprising a first glass member and a second glass member each includingat least one strengthened glass portion comprising a stress-engineeredglass material, at least the second glass member comprising at least oneweakened glass portion; and a bonding member connected between the firstand second glass members, the bonding member configured to transmit afracture force propagating from the first glass member to the secondglass member with energy sufficient to cause the at least one weakenedglass portion of the second glass member to fracture; wherein fractureof the at least one weakened glass portion of the second glass memberchanges functionality of the frangible structure.
 2. Thestress-engineered frangible structure of claim 1, wherein fracture ofthe at least one weakened glass portion of the second glass memberchanges functionality of the frangible structure by a loss of mass ofthe frangible structure.
 3. The stress-engineered frangible structure ofclaim 1, wherein fracture of the at least one weakened glass portion ofthe second glass member changes mechanical functionality of thefrangible structure.
 4. The stress-engineered frangible structure ofclaim 1, wherein: the frangible structure is a component of a machine;and fracture of the at least one weakened glass portion of the secondglass member changes functionality of the machine component.
 5. Thestress-engineered frangible structure of claim 1, wherein: the frangiblestructure is a movable component of a machine; and fracture of the atleast one weakened glass portion of the second glass member changesfunctionality of the movable machine component.
 6. The stress-engineeredfrangible structure of claim 1, wherein: the frangible structure is acomponent of a vehicle; and fracture of the at least one weakened glassportion of the second glass member changes functionality of the vehiclecomponent.
 7. The stress-engineered frangible structure of claim 1,wherein fracture of the at least one weakened glass portion of thesecond glass member changes functionality of electronic circuitrydisposed on the frangible structure.
 8. The stress-engineered frangiblestructure of claim 1, wherein fracture of the at least one weakenedglass portion of the second glass member changes functionality of one ormore electronic devices disposed on the at least one weakened glassportion of the second glass member.
 9. The stress-engineered frangiblestructure of claim 1, further comprising a trigger mechanism operablyattached to the first glass member, the trigger mechanism configured togenerate an initial fracture force sufficient to initiate transmissionof the fracture force from the first glass member to the second glassmember.
 10. The stress-engineered frangible structure of claim 9,further comprising a sensor configured to detect a predeterminedtransmitted signal, and configured to generate a trigger signal inresponse to detection of the predetermined transmitted signal, whereinthe trigger mechanism is configured to generate the initial fractureforce in response to the trigger signal.
 11. A stress-engineeredfrangible structure, comprising: a plurality of interconnected discreteglass members comprising a first glass member and a second glass membereach including at least one strengthened glass portion comprising astress-engineered glass material, at least the second glass membercomprising at least one weakened glass portion; and a bonding memberconnected between the first and second glass members, the bonding memberconfigured to transmit a fracture force propagating from the first glassmember to the second glass member with sufficient energy to cause the atleast one weakened glass portion of the second glass member to fracture;wherein fracture of the at least one weakened glass portion of thesecond glass member changes functionality of the frangible structurefrom a first functional state to a second functional state differentfrom the first functional state.
 12. The stress-engineered frangiblestructure of claim 11, wherein fracture of the at least one weakenedglass portion of the second glass member changes functionality of thefrangible structure by a loss of mass of the frangible structure. 13.The stress-engineered frangible structure of claim 11, wherein fractureof the at least one weakened glass portion of the second glass memberchanges mechanical functionality of the frangible structure.
 14. Thestress-engineered frangible structure of claim 11, wherein: thefrangible structure is a component of a machine; and fracture of the atleast one weakened glass portion of the second glass member changesfunctionality of the machine component.
 15. The stress-engineeredfrangible structure of claim 11, wherein: the frangible structure is acomponent of a vehicle; and fracture of the at least one weakened glassportion of the second glass member changes functionality of the vehiclecomponent.
 16. The stress-engineered frangible structure of claim 11,wherein: the frangible structure is a movable component of a machine;and fracture of the at least one weakened glass portion of the secondglass member changes functionality of the movable machine component. 17.The stress-engineered frangible structure of claim 11, wherein fractureof the at least one weakened glass portion of the second glass memberchanges functionality of electronic circuitry disposed on the frangiblestructure.
 18. The stress-engineered frangible structure of claim 11,further comprising a trigger mechanism operably attached to the firstglass member, the trigger mechanism configured to generate an initialfracture force sufficient to initiate transmission of the fracture forcefrom the first glass member to the second glass member.
 19. A method forproducing a stress-engineered frangible structure, the methodcomprising: providing a plurality of discrete glass members eachincluding at least one strengthened portion comprising astress-engineered glass material; and interconnecting the plurality ofdiscrete glass members such that each discrete glass member is connectedby way of a bonding member to an adjacent one of the discrete glassmembers, wherein: each bonding member is configured to transfer firstpropagating fracture forces from the at least one strengthened portionof a first glass member to the at least one strengthened portion of anadjacent second glass member such that secondary propagating fractureforces are generated in the adjacent second glass member in response tothe transferred first propagating fracture forces sufficient to causefracture of at least one weakened glass portion of the adjacent secondglass member; and fracture of the at least one weakened glass portion ofthe adjacent second glass member changes functionality of the frangiblestructure.
 20. The method of claim 19, further comprising providing atrigger mechanism configured to generate an initial fracture force inthe first glass member, wherein the initial fracture force generated inthe first glass member by the trigger mechanism is transferred by way ofthe bonding members to at least the adjacent second glass member.